This engineering position is for a Manufacturing Engineer / Tool Owner for the Plating sector concentrating but not limited to Thru-Silicon-Vias (TSV) Plating in the 300mm fab facility.
The TSV Plating Manufacturing Engineer duties will include, but not be limited to: work in New York Creates (NYC) 300mm semiconductor development facilities with responsibilities including owning and maintaining NYC's ASM NEXX Stratus 300 Plater & Ancosys Analyzers, Cu process development, evaluation, and characterization at the 32 nanometer technology node and beyond. Supporting NYC and all the partners in the consortium for the plating sector.
Additional duties will include: hands-on operation of all plating equipment; mentoring and training the technician staff; writing/updating operating procedures and specifications; internal and external customer applications support; and coordination of new equipment qualification. The successful applicant must be able to interface effectively with fab operations, process maintenance, and semiconductor engineering professionals from client companies; develop and characterize processes compatible with advanced plating technologies, including electroplating, electroless plating, and contact metallization; must use effective troubleshooting skills to solve process problems.
The successful candidate must execute tasks in Cu process deposition engineering development across a wide range of technology development projects, working side-by-side with a diverse group of process engineers; expected to establish and maintain advanced metal deposition/fill processes for CMOS scaled interconnect and TSV, to interact with liner/seed and CMP process groups, and to understand, define and eliminate process related defects.
Must be able to recover tool faults/fails
Process responsibilities are for Plating sector and supporting metrology. Expectations are to learn other sectors for example RIE/CMP/Films/Metrology/etc. to provide backup for fellow peer engineers and to be well rounded.
Maintaining and controlling various vendor tools to tight specifications dedicated by the needs of the technologies.
Establish process specifications and control charts for tool monitoring
Working knowledge of SIVIEW (MES) to implement the building of routes for tool controls as well as building WSPC charts for tool monitoring
The tools will be controlled using SPC charts and Western Electric Rules.
Learning various toolsets across multiple tooling vendors
In addition, the engineer will manage technicians to support the fab for 24/7 coverage.
Able to track and process lots on tools as needed for the business commitments
Responsible for writing/updating operational procedures (MPS) for each toolset/processes
Responsible for the backing up of tool parameters and process recipes at some set time interval
Able to train and certify operators to process these tools after releasing of the tool to OPS
Develop a good working relationship with all the FSE that support the tools.
The applicant will need to work for tooling vendors and operations management on a daily basis.
Time management is a must to work effectively between process support and equipment support
Attend daily operations meetings as needed. Required to attend/represent when tool is down with action plans.
The successful applicant must be able to interface effectively with fab operations, process maintenance, and semiconductor engineering professionals from client companies. Must exhibit self-discipline and be able to work under minimal supervision. Must react to tool downs and report daily on status of tools until tools are requalified and fab operation resumes. Must be accountable for individual results and for the impact of the results on the team. Accuracy, quality and productivity are all required.
Other reasonable duties as assigned.