NY Manufacturing Extension Partnership

Semiconductor Packaging Engineer

SUNY-Polytechnic Institute
Published
12/27/2021
Location
Albany, New York
Category
Job Type

Description

This position is to be filled with an applicant that can collaborate with a cross-functional multi-diverse team supporting photonics and electronic integrated circuit technologies.

The position is for a back-end process / packaging engineer to join our packaging process engineering team to support manufacturing and development of semiconductor-based optics/optoelectronic components. This engineer will sustain the process and equipment of wafer back-end manufacturing processes, such as die singulation, pick & place and sorting, wire bonding, flip chip die bonding, underfills, encapsulation molding. micro-dispensing, optical alignment, polishing, hermetic packaging and final printed circuit board laminate assembly. Strong technical background in either optoelectronics or semiconductor device packaging with knowledge of Cu pillar and Pb free solder bumps industry experience is highly preferred.

This role assumes ownership of process flow and integration of all associated processes within the packaging process segment as well as with any WLP process interface and will be responsible for defining and developing package assembly process flow, material set, test vehicle, DOEs, process control plans to successfully develop and sustain reliable manufacturable products.

Other reasonable duties as assigned.

MINIMUM QUALIFICATIONS:

B.S. degree in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND 1-5 years of relevant professional industry experience.

Temporary assignment to work in Albany may be required 1- 3 months prior getting tools installed in Rochester.

PREFERRED QUALIFICATIONS:

M.S. degree in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND 1-5 years of relevant professional industry experience.

OR Ph.D in Chemical Engineering, Materials Science, Electrical Engineering, or equivalent Engineering and/or Science discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND 1-3 years of relevant professional industry experience.
Applicants must address in their applications their abilities to work with a culturally diverse population. This position is contingent on the satisfactory completion of a background check; this position may require annual background checks.

 

Contact:

[email protected]

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